Mỡ hàn Soldering Paste JYD

Mỡ hàn Soldering Paste JYD

Mỡ hàn Soldering Paste JYD

Mô Tả Sản Phẩm Mỡ hàn Soldering Paste JYD:

Mỡ hàn Soldering Paste JYD là sản phẩm không thể thiếu trong quá trình hàn mạch điện tử, đặc biệt là hàn linh kiện SMD. Mỡ hàn Soldering Paste JYD đóng vai trò là dung môi gần giống nhựa thông được sử dụng khi hàn thiếc. Tuy nhiên, Mỡ hàn Soldering Paste JYD là sản phẩm công nghiệp có ưu điểm vượt trội so với nhựa thông. Nó làm tăng chất lượng mối hàn. Hàn nhanh hơn, ngấu hơn, mịn hơn. Đặc biệt ta không thể dùng nhựa thông làm trợ dung để hàn các linh kiện điện tử dán bề mặt, mà bắt buộc phải là Mỡ hàn Soldering Paste JYD.

Đặc tính kỹ thuật của Mỡ hàn Soldering Paste JYD:

Có chứa nhựa thông
Độ dẫn cao
Ngấu thiếc
Cách nhiệt tốt
Neutral PH7 + 0.3
Không độc, không ăn mòn
Bề mặt hàn mịn
Không biến đổi, không có dư lượng
Trọng lượng: 97g

Ngoài ra các bạn có thể tham khảo thêm các sản phẩm khác tại : Phụ kiện sửa chữa điện tử

Mo han Soldering Paste JYD 2

Tham khảo thêm về Mỡ hàn Soldering Paste JYD :

A majority of the defects in circuit-board assembly are caused due to issues in the solder-paste printing process or due to defects in the solder paste. There are many different types of defects possible, i.e. too much solder, or the solder melts and connects too many wires (bridging), resulting in a short circuit. Insufficient amounts of paste result in incomplete circuits. Head-in-pillow defects, or incomplete coalescence of ball grid array (BGA) sphere and solder paste deposit, is a failure mode that has seen increased frequency since the transition to lead-free soldering. Often missed during inspection, a head-in-pillow (HIP) defect appears like a small head resting on a pillow with a visible separation in the solder joint at the interface of the BGA sphere and paste deposit.[1] An electronics manufacturer needs experience with the printing process, specifically the paste characteristics, to avoid costly re-work on the assemblies. The paste’s physical characteristics, like viscosity and flux levels, need to be monitored periodically by performing in-house tests.

When making PCBs (printed circuit boards), manufacturers often test the solder paste deposits using SPI (solder paste inspection). SPI systems measure the volume of the solder pads before the components are applied and the solder melted. SPI systems can reduce the incidence of solder-related defects to statistically insignificant amounts.

A solder paste is essentially powdered metal solder suspended in a thick medium called flux. Flux is added to act as a temporary adhesive, holding the components until the soldering process melts the solder and makes a stronger physical connection. The paste is a gray, putty-like material. The composition of the solder paste varies, depending upon its intended use. For example, when soldering plastic component packages to a FR-4 glass epoxy circuit board, the solder compositions used are eutectic Sn-Pb (63 percent tin, 37 percent lead) or SAC alloys (tin/silver/copper, named for the elemental symbols Sn/Ag/Cu). If one needs high tensile and shear strength, tin-antimony (Sn/Sb) alloys might be used with such a board. Generally, solder pastes are made of a tin-lead alloy, with possibly a third metal alloyed, although environmental protection legislation is forcing a move to lead-free solder.

Solder paste is thixotropic, meaning that its viscosity changes over time with applied shear force (e.g., stirring). The thixotropic index is a measure of the viscosity of the solder paste at rest, compared to “worked” paste. Depending upon the formulation of the paste, it may be very important to stir the paste before it is used, to ensure that the viscosity is appropriate for proper application.